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資源

作者	Madenci, Erdogan.

標題 Fatigue life prediction of solder joints in electronic packages with ANSYS / Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

出版資料	Boston, Mass : Kluwer Academic Publishers, 2002.

複本

館藏地	索書號	狀態
IU 3rd Floor	TK7870.15 .M32 2002	AVAILABLE

說明	xx, 185 p : ill ; 25 cm. + 1 CD-ROM (4 3/4 in.)
系列	Kluwer international series in engineering and computer science ; SECS 719
Bibliography	Includes bibliographical references and index.
主題	Electronic packaging -- Computer-aided design.
	Solder and soldering -- Quality control.
	Metals -- Fatigue.
	Service life (Engineering) -- Forecasting.
	ANSYS (Computer system)
添加作者	Guven, Ibrahim.
	Kilic, Bahattin.
國際標準書號	1402073305 (alk. paper)