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作者	Madenci, Erdogan.

题名 Fatigue life prediction of solder joints in electronic packages with ANSYS / Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

出版资料	Boston, Mass : Kluwer Academic Publishers, 2002.

复本

馆藏地	索书号	处理状态
IU 3rd Floor	TK7870.15 .M32 2002	AVAILABLE

载体形态	xx, 185 p : ill ; 25 cm. + 1 CD-ROM (4 3/4 in.)
丛编	Kluwer international series in engineering and computer science ; SECS 719
Bibliography	Includes bibliographical references and index.
主题	Electronic packaging -- Computer-aided design.
	Solder and soldering -- Quality control.
	Metals -- Fatigue.
	Service life (Engineering) -- Forecasting.
	ANSYS (Computer system)
其它责任者	Guven, Ibrahim.
	Kilic, Bahattin.
国际标准书号	1402073305 (alk. paper)