Titre Fatigue life prediction of solder joints in electronic packages with ANSYS / Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

Adresse Bibliographique

Boston, Mass : Kluwer Academic Publishers, 2002.

Exemplaires

Localisation	Cote	Statut
Innovative University Durant Collection	TK7870.15 .M32 2002	AVAILABLE

Description	xx, 185 p : ill ; 25 cm. + 1 CD-ROM (4 3/4 in.)
Collection	Kluwer international series in engineering and computer science ; SECS 719
Bibliography	Includes bibliographical references and index.
Sujet	Electronic packaging -- Computer-aided design.
	Solder and soldering -- Quality control.
	Metals -- Fatigue.
	Service life (Engineering) -- Forecasting.
	ANSYS (Computer system)
Autre Auteur	Guven, Ibrahim.
	Kilic, Bahattin.
ISBN	1402073305 (alk. paper)