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Titre Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.

Adresse Bibliographique New York, N.Y : American Society of Mechanical Engineers, c1998.

Exemplaires

Localisation Cote Statut
 Innovative University Durant Collection  TK7870.15 .T483 1998    AVAILABLE
Description v, 141 p : ill ; 28 cm.
Collection EEP ; vol. 24
EEP (Series) ; vol. 24.
Notes "Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword.
Bibliography Includes bibliographical references and author index.
Sujet Electronic packaging -- Testing.
Electronic packaging -- Materials -- Fatigue.
Thermal stresses.
Deformations (Mechanics)
Autre Auteur Liu, S (Sheng), 1963-
Qian, Zhengfang.
Yeh, Chao-pin.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
International Mechanical Engineering Congress and Exposition (1998 : Anaheim, Calif)
ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures (1998 : Anaheim, Calif)
ISBN 0791815919
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